LENOVO THINKREALITY
During my Summer 2024 Industrial Design Internship at Lenovo, I supported the design team by developing a new head strap architecture for virtual reality headsets that spreads the headset’s weight out over a large area without being visually bulky. I took a dynamic approach, spending much of my time in the model shop concepting and constructing by hand, in addition to prototyping with 3D prints. The full process imagery and materials are confidential.
