Lenovo ThinkReality

AR/VR Deep Dive

SUMMER 2024: INTERNSHIP PROJECT

During my Summer 2024 Industrial Design Internship at Lenovo, I developed a new head strap architecture for virtual reality headsets that spreads the headset’s weight out over a large area without being visually bulky. I spent much of my time in the model shop concepting and constructing by hand, in addition to prototyping with 3D prints.

The full process imagery and materials are confidential.